Researcher Archive

Tetsu Yonezawa
Faculty of Engineering
Professor
Keyword
  • Low-temperature sintering process
  • High-reliability bonding
  • High fracture strength materials
  • Conductive paste
  • Via filling
  • 3D integrated wiring technology
  • Copper sintered interconnects
  • High-density wiring
  • Low-temperature process packaging
  • Next-generation semiconductor packaging
  • Copper nano-ink technology
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