Mission

Combining state-of-the-art electron microscopy techniques with AI to measure and analyze ultra-fine 3D structures enables the development of novel phenomena originating from nanostructures.

Core competence

Capable of characterizing devices and interfaces using a combination of spectroscopic equipment (e.g., an X-ray photoelectron spectrometer and a Raman microscope) and microscopic analysis equipment (e.g., Cs(Spherical Aberration)-corrected scanning transmission electron microscopes and the world’s only multi-quantum beam high voltage electron microscope).

Member

Divisional Director

Tamaki Shibayama

Professor of the Faculty of Engineering

Hiromichi Ohta

Professor of the Research Institute for Electronic Science